| 摘要 |
PURPOSE:To prevent a warp or break from occurring in a board, and also, downsize a plastic molded semiconductor device by removing a protective cover. CONSTITUTION:In a plastic molded semiconductor device, which is constituted by forming a dam 10 consisting of first resin having a specified thickness more than the height of a wire lead part connecting a conductor with a circuit element, at the required section around the conductor and the circuit element made on insulating substrates 2 and 3, and injecting second resin into the inside of this dam 10, the first resin is constituted of resin whose hardness is 65 or over (that hardness is a value being measured by a type D durometer hardness tester as specified by JIS K6253). And, the second resin is constituted of resin whose hardness is under 65 so as to prevent a warp from occurring in the insulating board. |
