| 摘要 |
PURPOSE: To provide the manufacture method of a known good die, which can previously form solder bumps on the bonding pads of the die from the stage of a wafer process. CONSTITUTION: The process for forming the plural same circuit patterns on a wafer 10 and forming bonding pads 12 for the external connection of the respective circuit patterns, the process for forming solder bumps 14 on the bonding pads, the process for forming metal layers 16 for wire bonding on the solder bumps, and the process for cutting the wafer into the dies of the respective circuit pattern units after the meal layers are formed are provided. The process for holding the dies which are cut in a die holder for test, the process for wire bonding between the circuit connection terminal of the die holder and the metal layers 16 of the held dies, the process for conducting the test on the dies and the process for removing the metal layers and the wire of the metal layers after the test process and obtaining the known good die where the solder bumps 14 are formed are contained. |
