| 摘要 |
The present invention is to form a new desirable silicon nitride film of lower dielectric constant even by using common gases. More preferably, it should be well compatible with copper wiring if it is applied as an interlayer insulating film. A silicon nitride film comprising a ratio of N:Si of from 1.0-1.1: and a ratio of O:Si of from 0.1-0.15:1, and being formed through catalytic CVD method by using monosilane and ammonia, and thereby having a relative dielectric constant of less than 6. Also, a semiconductor device is provided employing the above silicon nitride film as an interlayer insulating film, favorably, between copper layers.
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