| 摘要 |
PROBLEM TO BE SOLVED: To provide a small size furnace body used in the heat treatment process of a semiconductor wafer or the like and capable of being used up to a temperature higher than 1,000°C, and a rapid thermal annealing system, small in size and excellent in space-saving. SOLUTION: The heat treatment system is constituted of a heating unit comprising a thermal storage board, a heater arranged on the rear side of the thermal storage board, and a heat shielding body arranged on the rear side of the heater; and another heating unit having substantially the same structure as the heating unit, and arranged so as to have a space. The thermal storage boards are opposed to each other while a matter to be heated is arranged in the space between the thermal storage boards to effect the heat treatment by employing a furnace body unit. A big scale heat insulating member or the like does not exist in the furnace body unit whereby miniaturization is permitted. COPYRIGHT: (C)2006,JPO&NCIPI
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