发明名称 HEAT RESISTANCE POLYAMIDE COPOLYMER AND HEAT RESISTANCE POLYAMIDE RESIN COMPOSITION INCLUDING TEHREOF
摘要 The present invention relates to a highly heat-resistant polyamide copolymer and a highly heat-resistant polyamide resin composition comprising the same. More specifically, the present invention relates to a polyamide copolymer suitable to materials used in automatic components due to improved heat resistance and chemical resistance. To this end, copolymerized are an aromatic dicarboxylic acid component and a diamine component composed of an aliphatic diamine and a sulfone group-containing aromatic diamine.
申请公布号 KR20160085078(A) 申请公布日期 2016.07.15
申请号 KR20150002000 申请日期 2015.01.07
申请人 SAMSUNG SDI CO., LTD. 发明人 IM, SANG KYUN;LEE, KI YON;JUN, SUK MIN;SON, SU YEONG;CHOI, SUNG CHUL;KWON, SO YOUNG;JIN, YOUNG SUB
分类号 C08G69/32;C08G69/26;C08L77/06 主分类号 C08G69/32
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