发明名称 |
HEAT RESISTANCE POLYAMIDE COPOLYMER AND HEAT RESISTANCE POLYAMIDE RESIN COMPOSITION INCLUDING TEHREOF |
摘要 |
The present invention relates to a highly heat-resistant polyamide copolymer and a highly heat-resistant polyamide resin composition comprising the same. More specifically, the present invention relates to a polyamide copolymer suitable to materials used in automatic components due to improved heat resistance and chemical resistance. To this end, copolymerized are an aromatic dicarboxylic acid component and a diamine component composed of an aliphatic diamine and a sulfone group-containing aromatic diamine. |
申请公布号 |
KR20160085078(A) |
申请公布日期 |
2016.07.15 |
申请号 |
KR20150002000 |
申请日期 |
2015.01.07 |
申请人 |
SAMSUNG SDI CO., LTD. |
发明人 |
IM, SANG KYUN;LEE, KI YON;JUN, SUK MIN;SON, SU YEONG;CHOI, SUNG CHUL;KWON, SO YOUNG;JIN, YOUNG SUB |
分类号 |
C08G69/32;C08G69/26;C08L77/06 |
主分类号 |
C08G69/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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