MULTI-DIE WIREBOND PACKAGES WITH ELONGATED WINDOWS

摘要

A microelectronic package can include a substrate having first and second opposed surfaces extending in first and second transverse directions and an opening extending between the first and second surfaces and defining first and second distinct parts each elongated along a common axis extending in the first direction, first and second microelectronic elements each having a front surface facing the first surface of the substrate and a column of contacts at the respective front surface, a plurality of terminals exposed at the second surface, and first and second electrical connections aligned with the respective first and second parts of the opening and extending from at least some of the contacts of the respective first and second microelectronic elements to at least some of the terminals. The column of contacts of the first and second microelectronic elements can be aligned with the respective first and second parts of the opening.

主权项

1. A microelectronic package, comprising:
a substrate having first and second opposed surfaces, each extending in a first direction and a second direction transverse to the first direction, the substrate having a first opening extending between the first and second surfaces and defining first and second distinct parts each elongated along a first common axis extending in the first direction; first and second microelectronic elements each having a front surface facing the first surface of the substrate and a column of contacts at the respective front surface, the column of contacts of the first microelectronic element aligned with the first part of the first opening, the column of contacts of the second microelectronic element aligned with the second part of the first opening; a plurality of terminals exposed at the second surface, the terminals configured for connecting the microelectronic package to at least one component external to the microelectronic package; first electrical connections aligned with the first part of the first opening extending from at least some of the contacts of the first microelectronic element to at least some of the terminals; and second electrical connections aligned with the second part of the first opening extending from at least some of the contacts of the second microelectronic element to at least some of the terminals.