| 摘要 |
PURPOSE:To perform the position matching highly accurately for the subject semiconductor wafer by a method wherein a pneumatic bearing is provided on the retaining base, on which the semiconductor wafer is retained on its upper surface and a spherical base and a driven stick are provided on the lower surface, in such a manner that the above can be moved in vertical direction and rocked in two directions of orthogonal intersection. CONSTITUTION:The spherical bases 14' and 16' are provided on the lower surface of the wafer retaining base 14 which retains the semiconductor wafer 1, the driven stick 15 to be connected to a block 17 is provided, the retaining base 14 is supported on a vertically moving block 16 by feeding positive-pressured air through a tube 23, the rocking in the directions of an X-shaft and a Y-shaft is enabled by feeding air from tubes 18-22 and, and at the same time, a position matching is performed using a pulse motor 4, gears 5, 7 and a feeding screw 8 in such manner that the vertically moving block 16 is moved up and down. Through these procedures, a highly accurate positioning can be performed within the focus depth of the image formation of mask pattern without having the wafer surface to come in contact with other substances. |
