发明名称 SHEATH FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To obtain a high degree of airtightness for the titled sheath by a method wherein, when a plate member of metal or ceramic is airtightly sealed at one end of the opening of a square cylinder body made of ceramic and a cap is heat-sealed by fusing at the other end of the opening, two through holes are provided on the tube-shaped body, and said plate member is welded while inert gas of low temperature is being flown into the through holes. CONSTITUTION:On the back of the ceramic four-cornered tube-shaped body 1 whereon a solid- state image pickup element 5 is provided on the front, a metal plate 4 is adhered in such a manner that it is bridged to the circumferential wall, and a cooling material 8 is installed on the back of the metal plate 4. Also, on the inner circumference of the opening of the cover member, a gold-plated layer 2 is coated, and after the element 5 has been arranged on the metal plate 4 which is exposed on the inside of the opening, a rectangular glass plate 6 which will be turned to a transparent cap is placed through the intermediary of a gold-plated plate 7 which is in contact with the gold-plated layer 2. Subsequently, the gold-plated plate 7, which is exposed on the circumference of the glass plate 6, and the gold-plated layer 2 are adhered using a thermo-pressure welding head 9. At this time, an air feeding hole 10 and an air exhausting hole 11 are provided on the circumference of the four-cornered tube-shaped body 1, inert gas of low temperature is flown into these holes, and these holes are blocked up after adhesion of the plate member, using metal plates 16 and 17.
申请公布号 JPS5835945(A) 申请公布日期 1983.03.02
申请号 JP19810135111 申请日期 1981.08.28
申请人 TOKYO SHIBAURA DENKI KK 发明人 SUZUKI NOBUO
分类号 H01L23/08;H01L21/50 主分类号 H01L23/08
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