| 摘要 |
PROBLEM TO BE SOLVED: To uniformize the thickness of a mask to make the printing thickness uniform even when there are differences in roughness in the density of openings in a method for manufacturing a mesh integral-type metal mask. SOLUTION: Electrodeposition metals 6 and waste electrodeposition metals 14 are elctrodeposited on a surface which is not covered with a pattern resist film 11 of an electroforming matrix 10, corresponding to a mask base plate 3. Since the amount of electrodeposition per unit area is nearly constant in an electrodeposition method, by forming the metals 14 in a region A having a high opening density to set the electrodeposition area per unit area in the region A nearly equal to that of a region B having a low opening density, the mask thickness of the region A and that of the region B can be made equal to each other. A conductive mesh 5 is superposed closely to the metals 6 having the same mask thickness to form a plating, whereby the mesh 5 can be joined integrally to the metals 6. |
