| 摘要 |
A light emitting device is provided. The light emitting device includes a substrate, at least one light emitting chip and a first heat dissipation element. The substrate has a top surface and a bottom surface, and contacts are disposed on the top surface. The light emitting chip disposed on the top surface of the substrate is in contact with the contacts. The light emitting chip includes a light emitting layer, a positive electrode and a negative electrode. The light emitting layer is excited to emit a light by a current applied between the positive electrode and the negative electrode. The first heat dissipation element is disposed at the bottom surface of the substrate for transferring the heat generated by the light emitting chip out of the light emitting device, thus the operation temperature of the light emitting chip can be lowered.
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