| 发明名称 |
CIRCUIT BOARD STRUCTURE AND METHOD FOR MANUFACTURING A CIRCUIT BOARD STRUCTURE |
| 摘要 |
The present publication discloses a method for manufacturing a circuit-board structure. In the method, a conductor layer is made, which comprises a conductor foil (2) and a conductor pattern (6) on the surface of the conductor foil. A component (9) is attached to the conductor layer and the conductor layer is thinned, in such a way that the conductor material of the conductor layer is removed from outside the conductor pattern (6). |
| 申请公布号 |
WO2006134216(A2) |
申请公布日期 |
2006.12.21 |
| 申请号 |
WO2006FI00207 |
申请日期 |
2006.06.15 |
| 申请人 |
IMBERA ELECTRONICS OY;TUOMINEN, RISTO;IIHOLA, ANTTI;PALM, PETTERI |
发明人 |
TUOMINEN, RISTO;IIHOLA, ANTTI;PALM, PETTERI |
| 分类号 |
H01L21/48;H01L21/60;H01L23/13;H01L23/538;H01L23/544;H05K;H05K1/18;H05K3/20;H05K3/28;H05K3/30;H05K3/32;H05K3/40 |
主分类号 |
H01L21/48 |
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