发明名称 SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method, which has a high dielectric body as a gate insulating film, and has a proper threshold voltage. SOLUTION: The semiconductor device includes a semiconductor substrate 101, gate insulating films 108, 109 composed of a high dielectric body with high specific inductive capacity higher than a silicon oxide film, being prepared on the semiconductor substrate 101, a first gate electrode 110a for an N-type FET containing an aluminum layer prepared on the gate insulating film, and a second gate electrode 110b for P-type FET composed of Ni<SB>X</SB>Si<SB>Y</SB>(X>Y), being prepared on the gate insulating film. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008227165(A) 申请公布日期 2008.09.25
申请号 JP20070063689 申请日期 2007.03.13
申请人 TOSHIBA CORP 发明人 AOYAMA TOMONORI;SUGURO KYOICHI;KANEKO AKIO
分类号 H01L21/8238;H01L21/28;H01L21/3205;H01L21/768;H01L23/52;H01L23/522;H01L27/092;H01L29/423;H01L29/49;H01L29/78 主分类号 H01L21/8238
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