| 摘要 |
A super thin side-view light-emitting diode(LED) package and fabrication method thereof is provided to reduce manufacturing cost without changing a mold by removing a part of opaque housing and transparent coating to reduce whole thickness. In a super thin side-view light-emitting diode, a chip bonding process of electrically connecting the light emitting diode chip to the chip carrier is performed. The light emitting diode chip is positioned within a cavity. The transparent film the(encapsulant) is formed within the cavity, and it has the side view(side-view) light output surface which it is not covered with the opaque housing. And the light emitted from the light emitting diode chip is outputted through the side view light output surface. A portion of the opaque housing and portion of the transparent film are removed in order to reduce the total thickness of the opaque housing. |
