| 摘要 |
PURPOSE: To reduce the thickness of the display by mounting a film substrate packaged with light emitting diode chips at the rear surface of a display plate. CONSTITUTION: The light emitting diode chips are die bonded to the prescribed positions on the front surface of the film substrate 21. The electrodes of the respective light emitting diode chips and the wiring patterns of the film substrate 21 are connected by bonding wires. Lead wires 1 to 9 are soldered in transverse one row divided to two sets on the right and left in the lower side part of the rear surface of the film substrate 21. On the other hand, seven pieces of display segments 24 and four pieces of dot display windows 25 for displaying figures, symbols, etc., are formed on the display plate 23. The front ends of respective mounting projections 26 are so thermally deformed as to be caulked in the state of fitting respective mounting holes 27 formed on the film substrate 21 to the respective mounting projections 26 integrally molded at the plural points on the rear surface of the display plate 23, by which the film substrate 21 is fixed to the rear surface of the display plate 23. |
