发明名称
摘要 PURPOSE:To execute an accurate bonding operation and to shorten the manufacturing time by a method wherein a bonding tool is brought into contact with a pad obliquely and a process used to bend a wire and a bonding operation are executed simultaneously in order to eliminate a loosening part of the wire to be caused between the tip of the bonding tool and a clamper. CONSTITUTION:When a first bonding operation is executed, a bonding tool 4 is shifted obliquely with reference to a pad 3 and a wire 5 is brought into contact with the pad 3 in a state that the wire 5 is stretched straight from a guide hole 8 in the bonding tool 4. After that, the momment the wire is bent and comes into contact with the pad 3, the bonding operation is executed by means of an ultrasonic oscillation. Then, the bonding tool 4 is shifted to the upper part of a lead 6 in order to execute a second bonding operation; the tool is lowered; the wire 5 is connected to the lead 6. By this setup, the wire 5 is bent without being loosened; an irregularity in a length of a forcibly bent part 9 of the wire 5 is eliminated; it is possible to shorten the time required for the bonding operation.
申请公布号 JP2513785(B2) 申请公布日期 1996.07.03
申请号 JP19880147658 申请日期 1988.06.15
申请人 FUJITSU LTD 发明人 ABE MITSUO
分类号 H01L21/607;H01L21/60 主分类号 H01L21/607
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