| 摘要 |
PROBLEM TO BE SOLVED: To provide a pattern forming method capable of forming a prescribed pattern on a substrate to be processed using a UV cure process. SOLUTION: Resist patterns 4 and 5 with different line thicknesses are formed on a film 2 to be processed. A UV light absorbing film 6 is formed on the film 2 and the resist pattern 5, so that the upper side of the resist pattern 4 and the upper portion of the side wall of the resist pattern 5 are exposed. If UV light 7 is radiated in this state, UV cure reaction occurs in a region exposed from the UV light absorbing film 6 and a region R<SB>1</SB>surrounding it, however, no UV cure reaction occurs in a region R<SB>2</SB>covered with the UV light absorbing film 6. Therefore, contraction in the volume of a resist by UV cure can be selectively performed. COPYRIGHT: (C)2005,JPO&NCIPI |
