发明名称 |
PROCEDE POUR LA REALISATION DE MOYENS DE CONNEXION ET/OU DE SOUDURE D'UN COMPOSANT |
摘要 |
A layer (2) of ductile solder material e.g. indium, tin-lead is deposited on a silicon substrate (1). A connection mechanism is developed by stamping the ductile solder material by an etched die with desired forms of punches or shapes, where the depths between the shapes are identical or different. A residual material between the shapes is etched after etching a fine layer of ductile layer both on the shapes and between the shapes. |
申请公布号 |
FR2890066(B1) |
申请公布日期 |
2007.09.21 |
申请号 |
FR20050052611 |
申请日期 |
2005.08.30 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE ETABLISSEMENT PUBLIC A CARACTERE INDUSTRIEL ET COMMERCIAL |
发明人 |
MARION FRANCOIS |
分类号 |
B81B7/00;B81C99/00;H01L21/50;H01L21/603 |
主分类号 |
B81B7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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