SEALED LIGHT EMITTING DIODE ASSEMBLIES AND METHODS OF MAKING SAME

摘要

An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device.