| 摘要 |
PROBLEM TO BE SOLVED: To provide a film-like adhesive for semiconductor joining which can be made into a film without comprising a polymer component, can prevent decrease in adhesive strength, and has excellent joining reliability.SOLUTION: A film-like adhesive for semiconductor joining has an adhesive layer which has an epoxy (meth) acrylate oligomer with a weight average molecular weight of 900-5500, a curing agent and a filler, but has no polymer component.SELECTED DRAWING: None |
