发明名称 ADHESIVE FOR ELECTRONIC COMPONENT
摘要 An adhesive composition for a pre-applied underfill sealant comprising: (a) a radical polymerizable monomer having one or more functional groups selected from the group consisting of vinyl group, maleimide group, acryloyl group, methacryloyl group and allyl group, (b) a polymer having a polar group, (c) a filler, and (d) a thermal radical initiator.
申请公布号 US2016190094(A1) 申请公布日期 2016.06.30
申请号 US201615066181 申请日期 2016.03.10
申请人 HENKEL AG & Co. KGaA ;HENKEL IP & HOLDING GMBH 发明人 Yoko Sugiura;Yusuke Horiguchi;Sano Mieko;Hoang Gina
分类号 H01L23/00;H01L21/78 主分类号 H01L23/00
代理机构 代理人
主权项
地址 Duesseldorf DE