BI-COATED LEAD-FREE SOLDER BALL, AND METHOD FOR PREPARING THEREOF USING ELECTROLESS PLATING

摘要

The present invention relates to a Bi-coated, lead-free solder ball comprising an Sn-Ag-Cu solder ball and a Bi-coated layer on a surface of the Sn-Ag-Cu solder ball; and a preparation method thereof using an electroless plating method. According to the present invention, the Sn-Ag-Cu solder ball free of lead capable of soldering the solder ball at a temperature of 200°C or less is manufactured by forming a bismuth (Bi) coated layer on a surface of the Sn-Ag-Cu solder ball free of lead using an electroless plating method. The present invention provides a solution to a warpage problem in a chip, a package, and a substrate which use the Bi-coated Sn-Ag-Cu solder ball free of lead of the present invention by lowering a soldering temperature for the solder ball.