| 摘要 |
PROBLEM TO BE SOLVED: To provide chip component mounting method and mounting device which can three-dimensionally mount chip components on workpieces having various shapes and high in universal use.SOLUTION: A chip component mounting method orients a dispenser 15 in a direction along the normal line H1 of a tangent plane S1 at a target point O1 of a workpiece W while a table 28 is moved to a dispenser 15 side, executes a coating step of moving the dispenser 15 to the target point O1 along the normal line H1 and coating electrically conductive paste to the target point O1, subsequently moves the table 28 to a suction nozzle 22 side along one axis, rotates the table 28 around the vertical axis to confront the target point O1 to the suction nozzle 22, then orients the suction nozzle 22 along the normal line H1, moves the suction nozzle 22 to the target point O1 along the normal line H1 and mounts a chip component P at the target point O1.SELECTED DRAWING: Figure 1 |
