TSV redundancy scheme and architecture using decoder/encoder

摘要

A method of redirecting signal bits associated with or corresponding to defective TSVs of a TSV array to a row or a column of redundant TSVs in the TSV array using a 2:4 Decoder and 4:2 Encoder and the resulting device are provided. Embodiments include forming a TSV array between a bottom die and a top die of a 3D IC stack, the TSV array having a row and a column of redundant TSVs; identifying a defective TSV of the TSV array; determining whether to shift a signal bit associated with or corresponding to the defective TSV in a first and/or a second direction towards the row or the column of redundant TSVs; and shifting the signal bit in the first and/or the second direction until the signal bit has been redirected to the row or the column of redundant TSVs.

主权项

1. A method comprising:
forming a through silicon via (TSV) array between a bottom die and a top die of a three-dimensional (3D) integrated circuit (IC) stack, the TSV array having a row and a column of redundant TSVs, wherein each TSV in the TSV array is connected to a 2:4 Decoder in the bottom die and a 4:2 Priority Encoder in the top die; identifying a defective TSV of the TSV array; determining whether to shift a signal bit associated with or corresponding to the defective TSV in a first and/or a second direction towards the row or the column of redundant TSVs; and shifting the signal bit in the first and/or the second direction until the signal bit has been redirected to the row or the column of redundant TSVs.