发明名称 |
Method and apparatus for simultaneously bonding a plurality of lead frames to a plurality of planar articles |
摘要 |
Method and apparatus are disclosed for concurrently thermocompression bonding a plurality of lead frames to a plurality of planar articles. In operation, a plurality of lead frames are referenced to a plurality of unheated bonding tips and to the associated metallized bonding sites on a first side of a plurality of planar articles. The bonding tips are then simultaneously activated to independently move the referenced lead frames and articles in a first direction to engage the second side of each article with a heated thermode, and apply a sufficient compressive force to bond the leads of each lead frame to the associated bonding sites on the referenced article. The bonding tips are then returned to their initial or starting position.
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申请公布号 |
US3941297(A) |
申请公布日期 |
1976.03.02 |
申请号 |
US19750583213 |
申请日期 |
1975.06.02 |
申请人 |
WESTERN ELECTRIC COMPANY, INC. |
发明人 |
BURNS, JOHN ANDREW;SIVO, JR., ANDREW ROBERT |
分类号 |
H01L21/603;B23K20/02;H01L21/00;H01L21/60;H05K13/04;(IPC1-7):B23K19/00;B23K37/04 |
主分类号 |
H01L21/603 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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