| 摘要 |
PURPOSE:To decrease heat resistance and to improve the bonding strength of a heat sink, by forming predetermined grooves like a mesh on the surface of the heat sink to be opposed to an element securing section and bonding the heat sink to the element securing section by means of an adhesive. CONSTITUTION:A semiconductor element 5 is secured to an element securing section 6 of a package 1 and metallic wires 4 are provided to connect them. The assembly is sealed with a cover member 3 and then the projection 9 of a heat sink 8 on which grooves 9-1 are formed like a mesh is secured to the element securing section 6 by means of an adhesive 7. Since the surface of the projection of the heat sink 8 is improved in this manner, the heat sink 8 of the semiconductor device can be bonded to the element securing section 6 by means of the adhesive without causing increase of heat resistance due to air bubbles in the adhesive or deterioration of bonding strength of the heat sink. In this manner, the bonding strength can be improved while the adhesive can be applied in a uniform thickness. |
