SEMICONDUCTOR ELEMENT MODULE AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor element module capable of preventing the short of leads due to the inflow of solder to be used for mounting a semiconductor element module through a through-hole formed on a substrate on the substrate between the bottom face of a package and the substrate. SOLUTION: A recessed difference in level is formed so that a space with a lead can be formed at the package mounting face side of a package side face.