发明名称 INTEGRATED POWER CIRCUIT WITH DISPERSED BONDING AND CURRENT DISTRIBUTION AND ITS METHOD
摘要 PROBLEM TO BE SOLVED: To enable layout in an active region also under contact pads of a semiconductor integrated circuit. SOLUTION: This semiconductor integrated circuit comprises a power transistor arranged in a transverse direction, an array of the contact pads for power supply distributed on the transistor, means for providing current which is dispersed mainly vertically from the contact pads to the transistor, and means for connecting the power supply to each contact pad. By means of arranging the contact pads for power supply just on the active power transistor, precious silicon resource is saved and dispersing of the heat energy that active components release is promoted.
申请公布号 JP2002164437(A) 申请公布日期 2002.06.07
申请号 JP20010262416 申请日期 2001.07.27
申请人 TEXAS INSTRUMENTS INC 发明人 EFLAND TAYLOR R;PENDHARKAR SAMEER
分类号 H01L29/41;H01L21/3205;H01L21/60;H01L21/82;H01L21/822;H01L21/8234;H01L23/485;H01L23/495;H01L23/52;H01L23/528;H01L27/04;H01L27/088;H01L29/78 主分类号 H01L29/41
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