| 摘要 |
PROBLEM TO BE SOLVED: To provide the dust removing member of a substrate processing apparatus which can be conveyed certainly in the substrate processing apparatus, and which can remove simply, certainly an adhering foreign matter. SOLUTION: The dust removing member of the substrate processing apparatus includes a dust removing layer which performs polymeric curing of a curing type adhesive containing a pressure sensitive adhesive polymer, a polymerizable compound having two or more unsaturated double bonds in a molecule, and a polymerization initiator with an active energy source. In the dust removing member of the substrate processing apparatus, at least one type of the polymerizable compound is made of a polymerizable compound having a bisphenol A skeleton. COPYRIGHT: (C)2005,JPO&NCIPI
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