| 摘要 |
<p>The present disclosure relates generally to resin formulations for sheet molding compounds. Particularly, but not by way of limitation, the invention relates to low-density thermosetting sheet molding compounds (SMC) comprising an organic-modified, inorganic clay, a thermosetting resin, a low profile agent, a reinforcing agent, a low-density filler, and substantially the absence of calcium carbonate. The present disclosure relates particularly to blends of isophthalate modified, maleic-glycol polyester resin-glycol and maleate-glycol polyester resins that provide low density, thermosetting SMC that yields exterior and structural thermoset articles, e.g. auto parts, panels, etc that have Class A Surface Quality.</p> |
