Liquid ejection head

摘要

Provided is a liquid ejection head that makes it possible to achieve both of the stability of bonding and the shortening of a bonding time when bonding an electrical wiring substrate where thick leads applied with large current and thin leads applied with small current are mixed and a printing element substrate. For this purpose, the electrical wiring substrate includes wiring lines having different widths, and each of the wiring lines of the electric wiring substrate and a connecting terminal of the printing element substrate are connected by inner leads whose number corresponds to width of the wiring line.

主权项

1. A liquid ejection head comprising:
a printing element substrate that includes multiple connecting terminals; and an electric wiring substrate that includes a first wiring line having a first line width, a second wiring line having a second line width, and inner leads that separately connect the first wiring line to a connecting terminal and the second wiring line to a connecting terminal, wherein the first wiring line is provided with one of the inner leads, the second wiring line is provided with multiple inner leads, and the second line width is larger than the first line width.