Method for cutting substrate of irregular pattern and display device

摘要

A method for cutting a substrate of irregular pattern includes: forming a cutting line on the substrate, wherein the closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line; and applying an external force to the substrate so as to divide the substrate at the trough line. The method can remarkably improve accuracy and efficiency of cutting a substrate of irregular pattern.

主权项

1. A method for cutting a substrate of irregular pattern, comprising:
forming a cutting line on the substrate, wherein a closed region enclosed by the cutting line is the irregular pattern that is required; forming a trough line at the cutting line through an etching process; and applying an external force onto the substrate so as to divide the substrate at the trough line, wherein the external force is applied on the substrate through ultrasonic wave to cut the substrate at the trough line formed by the etching process.