发明名称 Silicon substrate including an edge portion, epitaxial structure including the same, and method of manufacturing the silicon substrate
摘要 Crack formation and propagation in a silicon substrate may be reduced by forming a crack reducing portion. The silicon substrate includes a silicon main portion and a silicon edge portion formed around the silicon main portion. The crack reducing portion is formed on the silicon edge portion of the silicon substrate such that the directions of crystal faces in the crack reducing portion are randomly oriented.
申请公布号 US9422638(B2) 申请公布日期 2016.08.23
申请号 US201213614315 申请日期 2012.09.13
申请人 Samsung Electronics Co., Ltd. 发明人 Kim Jun-youn;Kim Jae-Kyun;Chae Su-hee;Hong Hyun-gi
分类号 C30B25/18;H01L21/02;C30B29/06;C30B29/40 主分类号 C30B25/18
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A silicon substrate comprising: a silicon edge portion around a silicon main portion, the silicon main portion having a first flat top surface and the silicon edge portion having a second flat top surface, the second flat top surface being separate from the first flat top surface; and a crack reducing portion on the second flat top surface of the silicon edge portion such that directions of crystal faces of the crack reducing portion are different, wherein an interface between the silicon edge portion and the crack reducing portion is flat.
地址 Gyeonggi-do KR