Verfahren zum Zerteilen einer Halbleiterscheibe durch Ritzen und Brechen,申请号DE19681752866-传众专利搜索

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发明名称	Verfahren zum Zerteilen einer Halbleiterscheibe durch Ritzen und Brechen
摘要
申请公布号	DE1752866(A1)	申请公布日期	1971.04.08
申请号	DE19681752866	申请日期	1968.07.27
申请人	TELEFUNKEN PATENTVERWERTUNGSGESELLSCHAFT MBH	发明人	GEHRKE,DIETMAR
分类号	B28D5/00	主分类号	B28D5/00
代理机构		代理人
主权项
地址

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