发明名称 Heat pump system
摘要 A heat pump system includes a heat pump circuit, a load distribution element, and a controller. The heat pump circuit includes low-stage and high-stage compression mechanisms having a fixed capacity ratio relationship. The load distribution element establishes a load distribution between first and second heat loads subjected to heating processes by heat exchange with refrigerant discharged from the low-stage and high-stage compression mechanisms, respectively. The controller performs distribution control to maintain a ratio of 1 between temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively. Alternatively, the controller performs distribution control to reduce a difference between the temperatures of the refrigerant discharged from the low-stage and high stage compression mechanisms and after heat exchange with the first and second heat loads, respectively.
申请公布号 US9360241(B2) 申请公布日期 2016.06.07
申请号 US201113807710 申请日期 2011.07.13
申请人 Daikin Industries, Ltd. 发明人 Nakayama Hiroshi;Fujimoto Shuji
分类号 F25B30/02;F25B1/10;F24D17/02;F24D3/18;F25B40/00;F24D19/10 主分类号 F25B30/02
代理机构 Global IP Counselors 代理人 Global IP Counselors
主权项 1. A heat pump system comprising: a heat pump circuit including a compression mechanism with a low-stage compression mechanism and a high-stage compression mechanism having a fixed capacity ratio relationship, an expansion mechanism, and an evaporator, with a refrigerant being circulated through the heat pump circuit; a load distribution element configured and arranged to establish a load distribution between a first heat load subjected to a heating process by heat exchange with a refrigerant discharged from the low-stage compression mechanism, anda second heat load subjected to a heating process by heat exchange with a refrigerant discharged from the high-stage compression mechanism; and a controller configured to perform a distribution control of the load distribution element so as to maintain a ratio of 1 between a temperature of the refrigerant discharged from the low-stage compression mechanism and after heat exchange with the first heat load, anda temperature of the refrigerant discharged from the high-stage compression mechanism and after heat exchange with the second heat load; orso as to reduce a difference between the temperature of the refrigerant discharged from the low-stage compression mechanism and after heat exchange with the first heat load, andthe temperature of the refrigerant discharged from the high-stage compression mechanism and after heat exchange with the second heat load.
地址 Osaka JP