| 摘要 |
<p>PURPOSE:To transfer a semiconductor component to various processes while it is attached to a lead frame, to enhance an efficiency and to reduce a cost by a method wherein the tip of a bar, for support use, formed collectively at the lead frame or at a section bar is buried into a molding part, individual external terminals are processed and, after that, the bar for support use is cut. CONSTITUTION:Bars 8, 9 for support use protruding but not connecting to external terminals 5 to 7 are formed collectively at frames 2, 3 in a lead frame 1 or at section bars 4 connecting both frames mutually; during a molding process of a molding part 13, tip parts of the bars 8, 9 for support use are buried into the molding part 13. The individual external terminals 5 to 7 are cut from the lead frame 1; a performance inspection of a semiconductor chip 10 is executed; a forming operation of the individual external terminals 5 to 7 is executed; after that, the bars 8, 9 for support use are cut. Thereby, a semiconductor component can be conveyed without being cut from the lead frame when this component is transferred to various processes; the efficiency is enhanced; and the cost is reduced.</p> |
