| 摘要 |
PURPOSE: To provide a mount structure which connects conductors fitted to a carrier at difference height positions to contact places on a flat substrate. CONSTITUTION: On a surface 1 of the substrate, connection parts 5, 6, and 7 in a swelled shape are formed and made tall enough to reach the height position of individual conductors 15, 17, and 19 to which their connection parts fitted to the carrier 11 are bonded. In the extension plane of the conductors, the conductor and connection parts are bonded. To form the connection part in the swelled shape, sticking bodies of solder are stuck and formed on a pad formed on the surface of the substrate and the connection parts are made spherical by surface tension by performing a reflow process for the sticking bodies. The heights of the connection parts after the reflow process can be controlled by the area of the pad and the volumetric amount of the solder which is stuck and formed. |
