METHOD FOR REDUCING A TRANSIENT THERMAL MISMATCH

摘要

The invention relates to a method for reducing a transient thermal mismatch between a first component, such as a chip (2), and a second component, such as a module (1). The temperature of the chip (2) is controlled by the amount of energy which is dissipated by the chip (2). The chip (2) and the module (1) are in mechanical contact. If the temperature of the chip (2) is controlled to change only gradually during power on mechanical stresses between the module and the chip are thereby reduced.