| 摘要 |
PROBLEM TO BE SOLVED: To suppress the temperature rise of a semiconductor chip at an operating time to a low value, in a semiconductor device such as a solid-state image sensing device by the use of a package resin-molded into a recessed shape, for example. SOLUTION: A radiating board 4 is buried in the bottom part of the recession 1a of a package 1 resin-molded into a recessed shape. An opening 1b is provided in the package 1 at its part below the central part of a CCD chip 2 to be mounted on the bottom surface of the recession 1a, and the CCD chip 2 and the radiating board 4 are glued through this opening 1b with an adhesive agent 3. As an adhesive agent 3, one having a thermal conductivity larger than resin constituting the package 1 is used. |
