| 摘要 |
A method of manufacturing an electronic device ( 10 ) is proposed that comprises an insulating body ( 2 ) with at a surface a conductive pattern ( 1 ). According to the invention, a carrier ( 3 ) is provided with a first layer ( 4 ) and a second layer ( 5 ), which layers ( 4, 5 ) comprise different materials. After reshaping of the carrier ( 3 ) from the side of the second layer ( 5 ), insulating material ( 2 ) is provided at the side of the second layer ( 5 ), and the first layer ( 4 ) is removed, therewith providing the insulating body ( 2 ) with the conductive pattern ( 1 ). The reshaping may be done, for example, by bending or by forcing. The resulting body ( 2 ) is very suitable for use in modules, as part of a compact camera. Its shape may be defined with a mold. |
