发明名称 Sputtering apparatus and method
摘要 A sputtering apparatus comprises a chamber configured to contain at least one sputter target and at least one substrate to be coated. The chamber has at least one adjustable shielding member defining an adjustable aperture. The member is positioned between the at least one sputter target and the at least one substrate. The aperture is adjustable in at least one of the group consisting of area and shape.
申请公布号 US9410236(B2) 申请公布日期 2016.08.09
申请号 US201213689172 申请日期 2012.11.29
申请人 Taiwan Semiconductor Manufacturing Co., Ltd. 发明人 Yen Wen-Tsai;Wu Chung-Hsien;Chen Shih-Wei;Wu Ying-Hsin;Hsueh Jui-Fu;Chen Kuan-Chu
分类号 C23C14/34;C23C14/08;H01J37/32;C23C14/56 主分类号 C23C14/34
代理机构 Duane Morris LLP 代理人 Duane Morris LLP ;Koffs Steven E.
主权项 1. Sputtering apparatus, comprising: a chamber configured to contain therein at least one sputter target and at least one substrate to be coated; the chamber having a frame member from which at least one adjustable shielding member extends, defining an adjustable aperture, the shielding member positioned between the sputter target and the substrate, the aperture being adjustable in at least one of the group consisting of area and shape, wherein the at least one adjustable shielding member includes a plurality of slats, arranged in parallel along a length of the frame member along a same side of the aperture, the plurality of slats being movable independently from each other in a direction perpendicular to the length of the frame member.
地址 Hsin-Chu TW