发明名称 INJECTION MOLDED SUBSTRATE
摘要 PURPOSE:To obtain an injection molded substrate increased in peeling strength and bending strength to a great extent by a two-stage injection molding method. CONSTITUTION:The substrate consists of a first injection molded layer and a second injection molded layer having a thin wall thickness. Through holes 2 are provided in the first injection molded layer as a surface displacement part into which the second injection molded layer is to be intruded.
申请公布号 JPH05329885(A) 申请公布日期 1993.12.14
申请号 JP19920136839 申请日期 1992.05.28
申请人 HITACHI CABLE LTD 发明人 OUCHI KATSUAKI;ICHIGE TOSHIAKI
分类号 B29C45/16;B29L9/00;H05K1/02;H05K3/00;H05K3/18;(IPC1-7):B29C45/16 主分类号 B29C45/16
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