发明名称 |
INJECTION MOLDED SUBSTRATE |
摘要 |
PURPOSE:To obtain an injection molded substrate increased in peeling strength and bending strength to a great extent by a two-stage injection molding method. CONSTITUTION:The substrate consists of a first injection molded layer and a second injection molded layer having a thin wall thickness. Through holes 2 are provided in the first injection molded layer as a surface displacement part into which the second injection molded layer is to be intruded. |
申请公布号 |
JPH05329885(A) |
申请公布日期 |
1993.12.14 |
申请号 |
JP19920136839 |
申请日期 |
1992.05.28 |
申请人 |
HITACHI CABLE LTD |
发明人 |
OUCHI KATSUAKI;ICHIGE TOSHIAKI |
分类号 |
B29C45/16;B29L9/00;H05K1/02;H05K3/00;H05K3/18;(IPC1-7):B29C45/16 |
主分类号 |
B29C45/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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