A METHOD OF MANUFACTURING A HIGH VOLTAGE GaN-AlN BASED SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MADE

摘要

The present invention is directed to a technique for manufacturing semiconductor devices in which a one type GaN layer (2) is formed on a substrate (1) and semi-insulating AlN layer (3) is formed on one type GaN layer (2) with an opposite type GaN layer (4, 5) formed on the one type GaN layer (2) and partially below the AlN layer (4, 5). Highly efficient high power and high voltage semiconductor device are formed through this technique having better or similar properties to silicon type semiconductors.