| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technique by which the number of acquired chips in a wafer substrate can be increased without lowering the availability of the wafer at the time of transferring a mask pattern selected from among a plurality of mask patterns plotted on a mask substrate to the wafer substrate. SOLUTION: A desired mask pattern 4b selected from among a plurality of mask patterns 4 (4a-4d) is transferred to a wafer substrate 6 while the remaining nondesirous mask patterns 4a, 4c, and 4d are covered with a mask covering means 17 which makes mechanical movement with high accuracy. Since the distance between a blind substrate 20 and a mask substrate 3 constituting the covering means 17 can be made shorter than the conventional example, the occurrence of penumbra unsharp at the time of projection exposure can be reduced. Since the width of lines scribed on the substrate 6 can be made narrower, the number of acquired chips in the substrate 6 can be increased.</p> |
