| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of forming markers in the manufacture of semiconductor elements, which is capable of forming markers accurately, in matching with a crystal orientation at the same position of a semiconductor crystal substrate and which is superior in mass production. SOLUTION: This is a method, wherein a stepper marker pattern part 202 is formed on the main surface of a semiconductor crystal substrate. An exposing mark 201 is superposed at a position, where a segment-like pattern 205 formed on the main surface of the mark 201 matches with a cleavage orientation flat of the semiconductor crystal substrate, and under this condition the part 202 is transferred by contact exposure. As a result, the part 202 can be formed at the same place the semiconductor crystal substrate. Hence, by using a stepper aligner equipped with an automatic aligning function, the operating rate of an exposure process is improved, and thus high mass production capability can be obtained.</p> |
