SEMICONDUCTOR DEVICE HAVING SELF-ALIGNED CONTACT AND LANDING PAD STRUCTURE AND METHOD OF FORMING SAME

摘要

A semiconductor integrated circuit device and method of forming same is disclosed and includes a silicon substrate having a field oxide region and spaced active region. First and second self-aligned contact window openings are associated with a respective field oxide region and active region. A dummy polysilicon landing pad is formed over the field oxide region and formed below the first self-aligned contact window opening. An operative polysilicon landing pad is formed above the dummy landing pad. A silicon nitride barrier layer is also formed during the process.