| 摘要 |
PROBLEM TO BE SOLVED: To mount fine ball electrodes for a CSP(Chip Size Package) or BGA(Ball Grid Array) type semiconductor, reduce diameters of holes for forming electrodes, make an interconnection pattern finer, improve outer shape accuracy and to facilitate fabrication. SOLUTION: A plurality of interconnection films 4 are formed on portions of one surface of a base 5 consisting of an dielectric resin such that the film surface is positioned on the same plain as the base surface, and at least parts of the interconnection films are duplicated to electrode-forming holes 8 of the base. External electrodes protruding to the other side of the interconnection films are formed by filling each electrode-forming hole 8 with a conductive material. Subsequently, a semiconductor device 14 is flip-chip-connected onto the one surface of the base 5. |
