| 摘要 |
<p>The device (1) has a test packet, whose volume, geometrical shape and thermal properties e.g. radiation, are identical to the parallelepiped shaped products (2). A temperature sensor forms a series of temperature measures at close to a geometric center of the packet. Another temperature sensor forms another series of temperature measures in a surface point of the packet. An electronic chip (9) deduces an information e.g. maximum temperature, relative to a product from the two series of temperature measures. INDUSTRIAL STANDARDS - The temperature sensors conform to EN 12830 standards.</p> |
