| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mount type semiconductor device circuit device for performing emulation operation while it is directly connected to a printed circuit board. SOLUTION: A terminal 13 for connection to emulator which is connected to external terminals 11 is provided on the upper surface of a package separately from a plurality of external terminals 11 for connecting a signal wire of a semiconductor chip to be stored to a wiring pattern on a printed circuit board 6 in the package of a surface mount type semiconductor integrated circuit device 1. At the time of emulation, a connector 7 of an emulator is placed via a socket 2. A selector is incorporated in the package to electrically separate the signal wire of the semiconductor chip from the external terminals 11 when the socket 2 is inserted. |
