ADHESIVE TAPES FOR DIE BONDING

摘要

An adhesive tape for die bonding is disclosed, comprising a release film having a release layer on at least one side of a support and an adhesive layer attached to said release layer, wherein the exposed surface of said adhesive layer is a mirror-like surface having an average roughness on center line (Ra) of not more than 2.5 mu m and a maximal height (Rmax) of not more than 20 mu m.