发明名称 COMPOUND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
摘要 An embodiment of a compound semiconductor device includes: a substrate; a nitride compound semiconductor stacked structure formed on or above the substrate; and a gate electrode, a source electrode and a drain electrode formed on or above the compound semiconductor stacked structure. A recess positioning between the gate electrode and the drain electrode in a plan view is formed at a surface of the compound semiconductor stacked structure.
申请公布号 US2016204242(A1) 申请公布日期 2016.07.14
申请号 US201615076076 申请日期 2016.03.21
申请人 FUJITSU LIMITED 发明人 MAKIYAMA Kozo
分类号 H01L29/778;H01L29/40;H01L29/66;H01L29/20;H01L29/205 主分类号 H01L29/778
代理机构 代理人
主权项
地址 Kawasaki-shi JP